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• 14.5″ 3K OLED display, 8x JBL speakers, Dolby Atmos^®

• Stylus pen support, optional dual-mode keyboard

• Multi-screen collaboration via USB-C & Lenovo Freestyle

• Form Factor: 8U rack

• Processor: 2x 5^th Gen Intel^® Xeon^® Scalable processors

• GPU Support: 8x NVIDIA SXM H100/H200/B100 or AMD MI300x GPUs

• Memory: 32x TruDDR5 RDIMM slots at 5600MHz

• Drive Bays: Up to 16x 2.5″ NVMe drives

• Expansion Slots: Up to 10x PCIe Gen5 x16 adapters (8 front, 2 rear)

• Form Factor: 8U rack

• Processor: 8x 4^th Gen Intel^® Xeon^® Scalable processors

• GPU Support: No GPU support

• Memory: Up to 128x DDR5 DIMMs

• Drive Bays: Up to 16x E3.S EDSFF PCIe 5.0 NVMe or up to 16x 2.5” SAS/SATA SSDs

• Expansion Slots: 

• Support 6x FHHL x16 Gen5 slots at front

• Support up to 8x FHHL x16 Gen4 slots at rear

• Support up to 1x rear OCP (supports NCSI)

• Form Factor: 5U rack

• Processor: 2x 5th Gen Intel^® Xeon^® Scalable processors

• GPU Support: 8x NVIDIA SXM H200 

• Neptune™ Liquid cooling advanced thermal support for high-power GPUs, CPUs, and NVLink switches 

• Memory: 32x TruDDR5 RDIMM slots at 5600MHz

• Expansion Slots: Up to 10x PCIe Gen5 x16 adapters (8 front, 2 rear)

• Form Factor: 8U rack

• Processor: 2x 4^th Generation AMD EPYC™ Processors

• GPU Support: 8x AMD Instinct™ MI300x or NVIDIA H100/H200 GPUs

• Memory: Up to 24x TruDDR5 RDIMM slots

• Drive Bays: Up to 16x 2.5″ NVMe drives

• Expansion Slots: Up to 10x PCIe Gen5 x16 adapters

• Form Factor: Tower

• Processor: 2x 4th Gen Intel® Xeon® Scalable processors

• GPU Support: Up to 4x double-width or 8x single-width GPU adapters

• Memory: Up to 32x TruDDR5 DIMM slots

• Drive Bays: Up to 16x 3.5” HS SAS/SATA (up to 16x optional NVMe SSDs); Up to 32x 2.5” HS SAS/SATA (up to 24x optional NVMe SSDs)

• Expansion Slots: Up to 9x PCIe slots (5x Gen5 and 4x Gen4)

• Form Factor: 4U chassis

• Processor: 1x Intel^® Xeon^® E-2400 processor, up to 8 cores at 95W

• GPU Support: Optional NVIDIA Quadro T1000 or NVIDIA Quadro T400 GPU

• Memory: Up to 128GB TruDDR5 memory

• Drive Bays: Flexible enterprise storage options with up to 16x 2.5″ hot-swap or 8x 3.5″ hot-swap and simple-swap drive bays

• Expansion Slots: 4x PCIe slots (1x Gen5, 3x Gen4), including 1x PCIe Gen5 x16 slot

• Form Factor: 2U

• Processor: Up to 2x 4^th Generation AMD EPYC^™ Processors

• GPU: Up to 8x single-width LP GPUs or 3x double-width GPUs

• Memory: Up to 24x TruDDR5 memory slots Maximum 6TB using 256GB 3DS RDIMMs; up to 1DPC at 4400MHz

• Drive Bays: Up to 20x 3.5″ or 40x 2.5″ drives

• Expansion Slots: Up to 10x PCIe slots (9x PCIe 5.0) 1x OCP 3.0 adapter slot

• Form Factor: 2U height, short depth (440mm) 

• Processor: 1x AMD EPYC^TM 8004 Series Processor

• GPU Support: Up to 6 GPUs

• Memory: Up to 576GB in 6x slots using 96GB DIMMs

• Drive Bays: Up to 8x SATA/NVMe 2.5" 15mm drives

• Expansion Slots: Up to 2x PCIe G5 x16 FHFL + 2x PCIe x8 FHFL + 2x PCIe G4 x8 FHHL + 1x PCIe G5 x16 OCP 3.0

• Form Factor/Height: 4U rackable tower

• Processors: Up to 2x 3rd generation Intel^® Xeon^® Scalable processors, up to 250W

• Memory: Up to 4TB in 32x DIMM slots using 128GB DIMMs; Intel^® Optane™ Persistent Memory 200 Series module (PMem)

• Drive Bays: Up to 32x 2.5" bays (including 16 NVMe bays) or 16x 3.5" bays (including 8 NVMe bays)

• Expansion Slots: Up to 8x PCIe 4.0 slots plus 1x PCIe 3.1 slot (with 2x processors)

• Form Factor/Height: 2U rack server

• Processors: Up to 2x 5th Gen Intel^® Xeon^® Scalable processors, up to 60 cores and 350W TDP

• GPUs: Up to 8x single-width GPUs or 3x double-width GPUs

• Memory: Supports up to 32x TruDDR5 3DS/RDIMMs

• Drive Bays: Up to 20x 3.5” or 40x 2.5” drives; Up to 36x NVMe drives supported with PCIe retimer adapters

• Expansion Slots: Up to 12x PCIe 4.0/5.0 slots, 1x OCP 3.0 slot, 1x cabled internal HBA/RAID adapter that doesn't occupy a standard PCIe slot

Ideal server for expanding businesses looking for enterprise-level power in an easily-managed tower form factor.

ThinkEdge SE450 is a rugged compact-sized Edge AI server with enhanced processing power, increased security, and manageability for harsh environments.