ThinkSystem SD530
The density of blades, the economics of rack systems
ThinkSystem SD530
The density of blades, the economics of rack systems
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Tech Specs
DESCRIPTION SPECIFICATIONS Form Factor/Height 2U rack enclosure; 4 independent compute nodesProcessor Up to 2 second-generation Intel® Xeon® Platinum processors, up to 205WMemory Up to 2TB in 16x slots, using 128GB 3DS RDIMMs; 2933MHz TruDDR4 Expansion Slots 1x shuttle per D2 enclosure: either x8 PCIe Shuttle with 8x PCIe 3.0 x8 slots (2 per node); or x16 PCIe Shuttle with 4x PCIe 3.0 x16 slots (1 per node). Up to 2x external 1U trays (with up to 2 GPUs per node each) Drive Bays Up to 24x (6x per node) hot-swap 2.5" SAS/SATA HDDs/SSDs; up to 16x (4x per node) hot-swap 2.5" NVMe SSDs Network Interface Optional 8-port EIOM 10Gb SFP+ (2 ports per node); optional 8-port EIOM 10GbaseT RJ45 (2 ports per node) Power Supply 2x hot-swap/redundant 1+1 1600W/2000W; or 2x non-redundant 1100W Hot-Swap Components Power supplies, fans, SAS/SATA/NVMe storage devices; compute nodes are warm-swap RAID Support SW RAID supports JBOD; Entry RAID; optional HW RAID 12Gb supports JBOD; plus M.2 boot support with optional RAID Systems Management XClarity Controller embedded management, XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management GPU Tray Support The GPU Tray supports one or two GPU cards; Maximum of two GPU trays per D2 Enclosure OSes Supported Microsoft, Red Hat, SUSE, VMware. Visit lenovopress.com/osig for details. Limited Warranty 3-year customer replaceable unit and onsite service, next business day 9x5, optional service upgrades Specifications may vary depending upon region.
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3D Tour
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Features and Benefits
Dense optimized
ThinkSystem SD530 consists of a modular 2U Lenovo D2 Enclosure containing up to four front-access SD530 servers (nodes). Each node, incorporating two powerful Intel® Xeon® Processor Scalable family CPUs, achieves up to 36% faster performance than the previous generation.*
* Based on Intel internal testing, August 2018.
Modular design
The innovative design of the D2 enclosure provides the flexibility to meet varied needs in the modern data center. With multiple shuttle options, SharedIO, optional GPU tray, and support for Lenovo Neptune Thermal Transfer Module, the SD530 can be easily customized to your specific workload needs.
Workload-optimized support
Intel® Optane™ DC Persistent Memory delivers a new, flexible tier of memory designed specifically for data center workloads that offers an unprecedented combination of high capacity, affordability, and persistence. This technology will have a significant impact on real-world data center operations: reduction of restart times from minutes down to seconds, 1.2x virtual machine density, dramatically improved data replication with 14x lower latency and 14x higher IOPS, and greater security for persistent data built into hardware.*
* Based on Intel internal testing, August 2018.
Future defined data center
Lenovo delivers cost-effective, reliable and scalable solutions by combining industry-leading technology and the world’s best software-defined offerings with Lenovo ThinkShield, XClarity and TruScale Infrastructure Services to manage the life cycle of your data center needs. ThinkSystem SD530 supports the LiCO platform for simplified management of your HPC and AI workloads and cluster resources.
For more information on SD530 solutions that are changing the lives of our customers, visit lenovosuccess.com.
