ThinkSystem SD665 V3 High-Density Server
Liquid cooling innovation for a highly efficient data center
ThinkSystem SD665 V3 High-Density Server
Liquid cooling innovation for a highly efficient data center
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Tech Specs
ATTRIBUTE SPECIFICATION Form Factor Full-wide 1U tray; 2 nodes per tray Chassis DW612S Enclosure (6U) Processors 2x 4th Generation AMD EPYC™ Processors per node Memory Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray I/O Expansion Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported Internal Storage Up to 4x 2.5-inch NVMe SSDs (7mm height) or 2x 2.5-inch NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions RAID Support OS Software RAID Network Interfaces Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI) Power Management Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR) Systems Management Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements Front Access All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management. Rear access 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection Power Supply Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium)Supports up to N+1 redundancy Cooling Design Direct Water Cooling at the heat source with up to 50°C inlet water temperature OS Support Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information. Limited Warranty 3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available Specifications may vary depending upon region. -
3D Tour
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Features and Benefits
Lenovo Neptune™ technology
The ThinkSystem SD665 V3 with Lenovo Neptune Direct liquid cooling technology utilizes warm-water cooling (up to 50⁰C) to remove heat from the CPUs, memory, I/O, local storage, and voltage regulators. Because water provides superior heat removal compared to air, the critical components all operate at lower temperatures, delivering greater performance and density in quiet, energy efficient system.
Greater performance, density
The ThinkSystem SD665 V3 is powered by dual 4th Generation AMD EPYC™ Processors. Because of Neptune™ liquid cooling technology, it can run CPUs up to 400W in a compact, 1/2U form-factor, compared to 165-205W CPUs for air-cooled 1/2U systems. A single rack of ThinkSystem SD665 V3 servers can deliver more than half a Petaflop of HPC compute power without using accelerators.
Quiet efficiency
Because water cooling keeps the components cooler, the ThinkSystem SD665 V3 does not have fans, which are a major consumer of energy. Customers who have implemented Neptune™ DWC systems have estimated up to 40% savings on energy costs from hardware and software optimization. Removing the system fans eliminates the fan noise, providing nearly silent operation.
