ThinkSystem SD650 V3 High-Density Server
Liquid cooling innovation and leading energy efficiency packed into one smart ThinkSystem
ThinkSystem SD650 V3 High-Density Server
Liquid cooling innovation and leading energy efficiency packed into one smart ThinkSystem
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Tech Specs
ATTRIBUTE SPECIFICATION Form Factor Full-wide 1U tray (two SD650 V3 nodes per tray, six per DW612S Enclosure) Chassis DW612S Enclosure (6U)" Processor Two 4th Gen Intel® Xeon® Scalable processors per node, or 2x 4th Gen Intel® Xeon® CPU Max series processors with HBM per node; 2x nodes per 1U tray Memory Up to 2.0TB using 16x 128GB 4800 MHz per node I/O Expansion Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported. Internal Storage Up to 4x 2.5" SATA/NVMe SSDs (7mm height) or 2x 2.5" NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions RAID Support SATA controller with SW RAID or Intel VROC Network Interface Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI) Power Management Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR) Systems Management Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements Front access All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management. Rear access 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection Power Supply Up to 9x air CFF v4 (2400W PT, 2600W TT) /
Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium
N+1 redundancy (only air-cooled / without acceleration on DWC)Cooling Design Direct Water Cooling at the heat source with up to 45°C inlet water temperature OS Support Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information. Limited Warranty 3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available -
Features and Benefits
Lenovo Neptune™ technology
The ThinkSystem SD650 V3 with Lenovo Neptune™ Direct Water Cooling (DWC) technology utilizes warm-water cooling to remove heat from the CPUs, memory, local storage, and voltage regulators. By utilizing superior heat removal methods compared to air, the critical components all operate at lower temperatures, delivering greater performance in a quiet, energy-efficient system.
Greater performance, density
The ThinkSystem SD650 V3 is powered by dual 4th Gen Intel® Xeon® Platinum processor CPUs. Equipped with Neptune™ liquid cooling technology this server can handle the workloads that keep business running. A single rack of ThinkSystem SD650 V3 servers can deliver more than half a Petaflop of HPC compute power without using accelerators.
Cool under pressure and silent efficiency
Advanced water-cooling systems keep the components cooler so the ThinkSystem SD650 V3 does not rely on fans, which are a major consumer of energy. Customers who have implemented Neptune™ DWC systems have estimated up to 40% savings on energy costs from hardware and software optimization.
