ThinkSystem SD665-N V3 High-Density Server
Exascale performance for your AI & HPC workloads
ThinkSystem SD665-N V3 High-Density Server
Exascale performance for your AI & HPC workloads
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Tech Specs
ATTRIBUTE SPECIFICATION Form Factor Full-wide 1U tray; 1 node+GPUs per tray Chassis DW612S Enclosure (6U) Processor 1x or 2x 4th Generation AMD EPYC™ Processors per node Memory Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray I/O Expansion NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O Acceleration NVIDIA HGX™ H100 4-GPU with 4x NVLink connected SXM5 GPUs Storage Up to 2x 2.5″ NVMe SSDs (7mm height) or 1x 2.5″ NVMe SSDs (15mm height) per node
Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functionsRAID Support OS Software RAID Network Interfaces Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI) Power Management Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR) Systems Management Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements Front Access All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management. Rear access 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection Power Supply Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy Cooling Design Direct Water Cooling at the heat source with up to 45°C inlet water temperature OS Support Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information. Limited Warranty 3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available Specifications may vary depending upon region. -
3D Tour
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Features and Benefits
Lenovo Neptune™ accelerated
A decade of experience in direct water-cooling sets Lenovo apart. Lenovo ThinkSystem SD665-N V3 is based on our fifth generation Lenovo Neptune™ direct water-cooling platform.
The combination of market leading NVIDIA acceleration technology with the market leading water cooling solution from Lenovo results in extreme performance in an extreme dense packaging.
Accelerating your applications
ThinkSystem SD665-N V3 has 4 NVIDIA H100 Tensor Core GPUs that are interconnected through NVLink delivering notable HPC performance improvements, AI training, and inference workloads. With NVIDIA® CUDA®, you can accelerate 700+ supported HPC applications and every major deep learning framework:
- Chemistry like Gaussian and GROMACS
- Finite Elements like LS-DYNA and Simulia Abaqus
- Fluid Dynamics like OpenFOAM and ANSYS Fluent
- Molecular Dynamics like NAMD and AMBER
- Weather and Climate like WRF and ICON
Solutions that scale
Lenovo ThinkSystem SD665-N V3 is provided as a fully-integrated Lenovo Scalable Infrastructure (LeSI) solution, provides Best Recipe guides to warrant interoperability of hardware, software and firmware among a variety of Lenovo and third-party components.
With Lenovo intelligent Computing Orchestration (LiCO), you can support multiple users and scaling within a single cluster environment. LiCO allows you to leverage a single cluster for diverse workload requirements.
