ThinkSystem SD650

ThinkSystem SD650

ThinkSystem SD650

Liquid cooling innovation for a highly efficient data center

  • Delivers greater performance and density than air-cooled servers
  • Powered by Lenovo Neptune Liquid Cooling technology
  • Reduces data center energy costs up to 40%
  • Supports high-speed InfiniBand and Omni Path fabrics
  • Supports standard SSDs, NVMe SSDs, and M.2 boot SSDs, for even greater storage flexibility
  • Supports highest performance Intel Xeon Processor Platinum CPUs

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    Liquid cooling innovation for a highly efficient data center

  • Fitur


    Lenovo Neptune technology

    The ThinkSystem SD650 with Lenovo Neptune Direct to Node (DTN) technology utilizes warm-water cooling (up to 50⁰C) to remove heat from the CPUs, memory, I/O, local storage, and voltage regulators.

    Benefits of this solution include:

    • Superior heat conducting efficiency of water versus air, so critical server components operate at lower temperatures compared to air-cooled systems.
    • Running Intel Xeon Processor Scalable family CPUs up to 240W+ versus traditional air-cooled systems limited to 165W-205W.
    • Delivering greater performance with 30-40% data center energy savings.

    Learn more

    Lenovo ThinkSystem SD650 Rear View with Connection Manifold

    Innovative design

    The Lenovo ThinkSystem SD650 dual-node tray is designed for high performance computing (HPC), large-scale cloud, and heavy simulations. It supports workloads from technical computing to grid deployments to analytics and is ideally suited for fields such as research, oil and gas, and engineering. The SD650's unique water-cooling technology provides many key benefits. Compared to other technology, the SD650's direct water cooling:

    • Reduces data center energy costs by 40%
    • Increases system performance
    • Delivers 90% heat removal efficiency*
    • Creates a quieter data center
    • Enables data center growth without adding CRACs

    *Based on Lenovo internal testing

    Lenovo ThinkSystem SD650 Rear View with Nodes

    Maximum performance and management

    Designed to run the highest core-count Intel® Xeon® Scalable Family processors, the SD650 powers through demanding HPC workloads. Because water cooling removes more heat, CPUs can run in “turbo” mode nonstop, getting up to 10% greater performance from the CPU. For even greater system performance, the SD650 uses 2667MHz DDR4 memory and supports NVMe storage, high-speed EDR InfiniBand, and Omni Path adapters.

    The SD650 is managed by Lenovo Intelligent Computing Orchestrator (LiCO), a powerful management suite with an intuitive GUI that helps to easily manage large HPC cluster resources and accelerate development of AI applications.

    LiCO works with the most common AI frameworks, including TensorFlow, Caffe and Microsoft CNTK.

    Lenovo Intelligent Computing Orchestrator (LiCO)

    Extreme density

    One 6U NeXtScale n1200 Enclosure accommodates up to 12 SD650 compute nodes. The enclosure houses up to 24 processors, 9.2TB of memory, 24 SFF SSDs or 12 SFF NVMe drives, and 24 M.2 boot drives. Each SD650 offers up to 12 more cores per U than the previous generation.*

    * Compared to Lenovo NeXtScale nx360 M5

    Lenovo ThinkSystem SD650 Compute Node Bays

    Leading energy efficiency

    The ThinkSystem SD650’s direct water-cooling design provides extreme energy efficiency. With up to 90% heat removal efficiency, the SD650 provides up to a 40% savings in data center energy expense including:

    • 25% reduction in annual air conditioning use
    • 5% energy savings by running CPUs cooler
    • 4% savings by eliminating fans in the compute nodes

    For example, a large super computing center reuses the hot water produced by direct water cooling to save an estimated 45% in electricity costs and uses it to produce chilled water.

    Lenovo ThinkSystem SD650 Water-Cooling Design
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  • Spek Teknis

    Spek Teknis

    Form Factor
    Full-wide 1U tray (six per n1200 Enclosure)
    NeXtScale n1200 Enclosure (6U)
    2 second-generation Intel® Xeon® Scalable Processor Scalable family CPUs per node; 2x nodes per 1U tray
    Memory Up to 1.5TB using 12x 2933MHz TruDDR4 DIMMs per node or up to 2TB (512GB x4) using Intel® Optane™ DC Persistent Memory
    I/O Expansion
    1x 50mm width ML2 slot and 1x PCIe x16 slot for EDR InfiniBand or Intel Omni Path, per server node
    Internal Storage Up to 2x 2.5” SATA SSDs (7mm height) or 1x 2.5” NVMe SSDs (15mm height) per node; up to 2x M.2 SATA SSDs
    RAID Support Onboard SATA controller with SW RAID; optional Dual M.2 SSD adapter with HW RAID 1
    Network Interface 2x 1GbE BaseT NIC per node; additional high-speed network adapters (InfiniBand or Omni Path) can be installed in available front-accessible PCIe x16 adapter slot
    Power Management Rack-level power capping and management via Extreme Cloud Administration Toolkit (xCAT)
    Systems Management Supported by LICO and XCC
    OS Support Red Hat, SUSE, CentOS (with LeSI support); Visit for more info.
    Limited Warranty 3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available
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  • Resources

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