ATTRIBUTE SPECIFICATION Form Factor/Height 2U dense enclosure; 4x independent compute nodes (2U4N) Processors Two third-generation Intel® Xeon® Processor Scalable family CPUs, up to 250W Memory Up to 1TB using 16x 64GB 3200MHz TruDDR4 DIMMs per node Storage
- 2x 7mm 2.5-inch or 1x 15mm 2.5-inch hot-swap drives, supporting SATA or NVMe SSDs
- SW RAID; Intel VROC NVMe RAID-0 or RAID-1
- 2x M.2 SATA SSDs for boot functions
Network Interface Two onboard Ethernet interfaces: 1x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI) I/O Expansion 1x PCIe Gen 4 x16 low profile slot. For special bid configurations, the internal storage bay can be converted to a second PCIe Gen 4 x16 low profile slot. Power Supply 2x hot-swap power supplies, either 1800W, 2400W. N+1 redundancy with oversubscription Hot-Swap Components Power supplies, fans, SATA/NVMe storage devices; compute nodes are warm-swap Systems Management Lenovo XClarity Controller embedded management, XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power OS Support Microsoft, SUSE, Red Hat, VMware. Visit lenovopress.com/osig for details. Limited Warranty 3-year customer replaceable unit and onsite service, next business day 9x5; optional service upgrades§ ITIC Global Reliability Report
** Lenovo recommends limiting the number of modular enclosures in a daisy-chain to 7 modular enclosures.Specifications may vary depending upon region.
Features and Benefits
The system is a standard 2U4N, with four 1U, half wide, dual-processor ThinkSystem SD650 V2 servers (nodes), contained within a 2U ThinkSystem DA240 Enclosure. This allows users to pack up to 76 servers in a standard 42U rack, assuming 4U reserved for networking. That translates into over 5,400 processing cores per rack.
The ThinkSystem SD630 V2 is thermally designed to deliver maximum performance in the smallest package. Each node supports 225W CPUs without limitation, plus conditional support for up to 250W. The 3 UPI connections, and superior thermals, make the system ideal for HPC workloads. Each node incorporates two powerful 3rd Gen Intel® Xeon® Platinum processors.
Ready for growth
Because the ThinkSystem SD630 V2 is designed for massive scale-out workloads like HPC, AI, technical computing or analytics, it has to be cost-efficient. Its no-frills architecture features a 25GbE LOM which saves on networking, plus a 1GbE management port. The ThinkSystem DA240 Enclosure is built for fast node installation and can be daisy-chained together and managed as a single entity, reducing management cabling 92% compared to 1U systems.